Integrated circuit reliability prediction

Bullet Description

circuitos integrados

Ceit has extensive experience in predicting the reliability of integrated circuits. The following points summarize our main capabilities:

  • Tools for the controlled generation of cracks and predicting their progress in structures that show patterns.

  • Study of cohesive/adhesive failure through the use of cohesive elements in MCSN.

  • Adhesive or cohesive failure analysis in MCSN.

  • Comparison of experiments and modeling. Influence of toughness of the ES-Cu interface on M1.

Comparación entre experimentos