Integrated circuit reliability prediction
Description
Ceit has extensive experience in predicting the reliability of integrated circuits. The following points summarize our main capabilities:
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Tools for the controlled generation of cracks and predicting their progress in structures that show patterns.
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Study of cohesive/adhesive failure through the use of cohesive elements in MCSN.
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Adhesive or cohesive failure analysis in MCSN.
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Comparison of experiments and modeling. Influence of toughness of the ES-Cu interface on M1.