txtPredicción de fiabilidad de circuitos integrados
Reliability prediction of integrated circuits
Ceit has extensive experience in predicting reliability of integrated circuits. The following points summarize the main capabilities:
Tools for the controlled generation of cracks and prediction of their progress in structures that show patterns.
Study of cohesive / adhesive failure through the use of cohesive elements in MCSN.
Adhesive or cohesive failure analysis in MCSN.
Comparison between experiments and modeling. Influence of the toughness of the ES-Cu interface on M1