Integrated circuit reliability prediction
Ceit has extensive experience in predicting the reliability of integrated circuits. The following points summarize our main capabilities:
Tools for the controlled generation of cracks and predicting their progress in structures that show patterns.
Study of cohesive/adhesive failure through the use of cohesive elements in MCSN.
Adhesive or cohesive failure analysis in MCSN.
Comparison of experiments and modeling. Influence of toughness of the ES-Cu interface on M1.