Technological Solutions

Microelectronic processes for the fabrication of microsensors, MEMS and BioMEMS in small series.

High-capacity testing (±500 kN) to evaluate material behavior in controlled industrial environments.

Laboratory-scale simulation of multi-pass industrial processes under reversing conditions.

Evaluation of non-destructive testing based on magnetic hysteresis, Barkhausen noise and impedance measurements.

Simulation and optimal sizing of wastewater treatment plants (WWTPs) using proprietary PWM® libraries.

Measurement campaigns under real operating conditions to identify the origin of anomalous vibrations or degradation.

Assurance of Intrinsic Safety (IS) in electronic devices for explosive atmospheres.

Selection of positioning technologies (UWB, BLE-AoA, GNSS, IMU) according to required accuracy.

Design and production of metal powders with customized chemical compositions and morphologies.

Generation of nano- and micro-textures using femtosecond laser technology for high value-added products.

Study of the impact of hydrogen and other gases on steel quality during production processes.

Precise definition of the dimensional behavior of materials under thermal variations.

Characterization of large-scale or high-strength components under loads up to 600 kN.

High-resolution microstructural analysis using electron microscopy (FEG-SEM, TEM) and X-ray diffraction.

Experimental evaluation of elastomers for integration into finite element environments (FEM).

Calibration of multibody simulation (MBS) models through comparison with physical test data.

Infrastructure for design, simulation (ANSYS, CST) and validation of electronic and IoT systems.

End-to-end development service for complex electronic systems, from architecture to prototyping.

Technical and economic selection of wireless technologies (5G/6G, LoRa, Mioty, UWB) for product integration.

Optical inspection solutions for metrology and 2D/3D surface defect analysis.

Functional validation of solutions for critical infrastructures in a realistic hybrid environment.

Optimization of software architectures to ensure modularity and adaptability in private 5G environments.

Development of multimaterial joints for extreme applications through Hot Isostatic Pressing (HIP).

Integration of densification and heat treatments into a single cycle to optimize additive manufacturing.

High-precision thermal characterization using the Laser Flash Analysis (LFA) technique on dense and porous materials.

High-pressure and high-temperature gas sorption characterization for metal hydrides and CO₂ capture.

Stress measurement in areas smaller than 1 mm using electron microscopy and focused ion beam techniques.

Analysis of material embrittlement in hydrogen-rich environments under extreme conditions.

Vacuum casting using induction melting to achieve maximum metallurgical purity.

Evaluation of microstructural evolution through simulation of heat treatments and cold formability.

Development of TTT and CCT diagrams to predict microstructural evolution during heat treatments.

Identification of natural frequencies, mode shapes and damping through controlled excitation.

Technical support for homologation processes with NoBo and DeBo bodies.

End-to-end support from data analysis to production using MLOps/DevOps methodologies.

Analysis for the integration of AMRs, AGVs, cobots and mobile manipulators (MoMa).