Technological Solutions
FPGA and ASIC design
End-to-end development service for complex electronic systems, from architecture to prototyping.
See moreFeasibility study of wireless communication technologies for smart components
Technical and economic selection of wireless technologies (5G/6G, LoRa, Mioty, UWB) for product integration.
See moreThermal conductivity measurements up to 1000 °C
High-precision thermal characterization using the Laser Flash Analysis (LFA) technique on dense and porous materials.
See moreDesign of integrated HIP cycles for post-processing of highly critical components
Integration of densification and heat treatments into a single cycle to optimize additive manufacturing.
See moreMaterials study for solid-state H₂ storage
High-pressure and high-temperature gas sorption characterization for metal hydrides and CO₂ capture.
See moreFeasibility study of solid-state diffusion bonding
Development of multimaterial joints for extreme applications through Hot Isostatic Pressing (HIP).
See moreLocal residual stress measurement using FIB-DIC
Stress measurement in areas smaller than 1 mm using electron microscopy and focused ion beam techniques.
See moreMechanical testing in pressurized hydrogen and blended gas environments (up to 550 bar)
Analysis of material embrittlement in hydrogen-rich environments under extreme conditions.
See moreAlloy design
Vacuum casting using induction melting to achieve maximum metallurgical purity.
See moreOptimization of continuous annealing processes
Evaluation of microstructural evolution through simulation of heat treatments and cold formability.
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