Description

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We design and develop RF analogue, mixed-signal and digital integrated circuits and systems for wireless communications applications up to 86GHz. The close collaboration with the antennas group allows us to customize complete low-cost system solutions with a very low form factor for cutting-edge medical applications, high speed communications and imaging, wireless identification and monitoring of processes.

We develop solutions, from IC development, prototype assembly and small batch delivery to highest quantities for mass production. We also offer our expertise for feasibility studies, technology consulting and support at production start. Our services cover a wide range of applications, such as:

  • Complete integrated transceivers for Wireless Communications (both RF / analog front-end and mixed-signal /digital back-end)
  • Digital baseband processors
  • High data rate wireless communication links for backhaul applications
  • Custom RF & analogue circuit design and characterization (on-wafer and on PCB)
  • Intellectual Property (IP) digital cores
  • Complete Solutions for active / passive RF Identification Systems (RFID)
  • Real-Time Location Systems
  • Low-power batteryless integrated sensors and Wireless Sensor Networks
  • Ultra low-power ICs for energy management and micro-power harvesting
  • RF passive components modelling and characterization (inductor, varactor, ESD devices)
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We use state-of-the-art solid state silicon-based deep sub-micron technologies such as CMOS, BiCMOS and SiGe of a wide range of commercial semiconductor vendors, such as:

  • 0.8um BiCMOS from AMS
  • 0.35um BiCMOS SOI from HITACHI
  • 0.35um SiGe from AMS
  • 0.35um CMOS from XFAB
  • 0.18um CMOS from SEIKO-EPSON
  • 65nm, 90nm & 0.18um CMOS from UMC
  • 65nm, 90nm & 0.13um CMOS from TSMC
  • 55nm BiCMOS from ST

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